Passive electronic components are important electronic information products.Passive components and active components (semiconductor products such as integrated circuits) together constitute the core of the circuit, which is the foundation of various electronic information products.In new electronic products, integrated circuits and passive components account for 46.1% and 9.1% of the total production cost of all electronic components and components, while 12.7% and 55.1% of the total installation cost, and even the management and installation cost of some chip components have exceeded their prices.In recent years, with the acceleration of upgrading and upgrading of electronic information products, the further upgrading and integration of electronic components has attracted more and more attention from governments, industry and academic circles around the world.In particular, passive integration technology has entered the stage of application and industrialization due to the breakthrough of low-temperature co-firing ceramics (LTCC) and other technologies. The new generation of passive components and related integration technology have become the technical high point that attracts much attention.

For passive electronic components and high-end products and the key technology of passive integration problems, twelfth five-year "period, the ministry of science and technology launched the" study on key technology of passive integration components "national science and technology support project, the project relies on national engineering technology research center, new electronic components following industry cutting-edge technology development, the study of thick and thin film integration technology, respectively, to carry out integrated passive devices from material preparation, simulation design, technology, passive components reliability analysis of the whole process of integrated core key technology research.At present, developed with independent intellectual property rights of high-performance LTCC dielectric materials, functional thin film materials and passive integrated material system, mastered the fine of functional thin film deposition, high precision processing, integrated passive components design simulation, based on the low temperature co-firing ceramic (LTCC) passive integration process, the key techniques such as the preparation and the high precision thin film sensors, thin film attenuator, rf front-end module have the typical passive integrated components of exemplary role.It realizes the r&d, preparation and quantitative production of passive integrated devices and modules, thin film resistance, the WiFi/ bluetooth module based on LTCC technology, and NFC ferrite sheets.

In order to promote our materials science and technology innovation and industrialization, ministry of science and technology has made a "special" much starker choices-and graver consequences-in "materials science and technology innovation plan", will be key to passive electronic components materials, surface acoustic wave materials and device technology, high performance magnetic dielectric materials and other high-end optoelectronics and microelectronics materials as a development focus, to promote cross-border technology integration, conquers the highest position in advanced electronic materials technology.